Embedded passives technology for PCBs: Materials, design, and process

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 577-582

  Zhou, Jiming ^a   Myers, John D ^a   Felten, John J ^b  

^a DELPHI CORPORATION   (United States)

^b DuPont Electronic Technologies   (United States)

Author keywords

Embedded capacitors; Embedded resistors; Evaluation vehicle design; Material properties

Indexed keywords

CAPACITORS; ELECTROSTATICS; EMBEDDED SYSTEMS; PRINTED CIRCUIT DESIGN; RESISTORS; THERMAL CYCLING;

ELECTROSTATIC DISCHARGE; EMBEDDED PASSIVE TECHNOLOGY; EMULATOR DESIGN;

PRINTED CIRCUIT BOARDS;

EID: 0036448319     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. J. Peiffer, "Embedded Capacitor Material Evaluation", p1, AT2-2, IPC SMEMA Council APEX 2001
2. J. Wang and S. Clouser, "Thin Film Embedded Resistor", p7, IPC Review, June 2001
3. P. Bowles, "Reliability Evaluation of Embedded Decoupling Capacitance", pp1-8, AT2-3, IPC SMEMA Council APEX 2001
4. J. Prymak, S. Bhattacharya, K. Paik, Fundamentals of Passives: Discrete, Integrated, and Embedded, "Fundamentals of Microsystems Packaging", Ed. By R. R. Tummala, McGraw-Hill 2001
5. J. Savic, R. T. Croswell, A. Tungare, G. Dunn, T. Tang, R. Lempkowski, M. Zhang, and T. Lee, "Embedded Passives Technology Implementation in RF Applications", IPC EXPO 2002
6. J. Zhou and J. D. Myers, "Thermal Cycling and ESD Evaluation of Embedded Resistors and Capacitors in PWB", IPC Annual Conference 2001
7. J. J. Felten and S. Ferguson "Embedded Ceramic Resistors and Capacitors in PWB - Process and Design", IPC EXPO 2002