Indent reflow sealing (IRS) technique - a method for the fabrication of sealed cavities for MEMS devices

Journal of Microelectromechanical Systems

Volumn 9, Issue 2, 2000, Pages 206-217

  Tilmans, Harrie A C ^a,b   Van De Peer, Myriam D J ^b   Beyne, Eric ^b  

^a CP Clare Corporation   (Belgium)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENCAPSULATION; FLIP CHIP DEVICES; PLASMA APPLICATIONS; SHEAR STRENGTH; SOLDERING ALLOYS; THERMAL STRESS; TIN ALLOYS;

FLIP CHIP BONDING; FLUXLESS SOLDER BOND; HERMETICALLY SEALED CAVITY; METALLIC SEAL; MICRORELAY;

MICROELECTROMECHANICAL DEVICES;

EID: 0033718159     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.846701     Document Type: Article

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