A sealed cavity TFR process for RF bandpass filters

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 1996, Pages 95-98

  Lutsky, Joseph J ^a   Naik, Rajan S ^a   Reif, Rafael ^a   Sodini, Charles G ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC RESONATORS; ACOUSTIC SURFACE WAVE FILTERS; ACOUSTIC BULK WAVE DEVICES; BANDPASS FILTERS; CAVITY RESONATORS; CIRCUIT RESONANCE; PIEZOELECTRIC MATERIALS; SEMICONDUCTING SILICON; THIN FILMS; VLSI CIRCUITS;

CENTRE FREQUENCY; FREE STANDINGS; INTEGRATED SOLUTIONS; PIEZOELECTRIC FILM; Q-SERIES; RF BANDPASS; SEALED CAVITIES; THIN-FILM BULK ACOUSTIC WAVE RESONATOR;

BANDPASS FILTERS; INTEGRATED CIRCUIT MANUFACTURE;

INSERTION LOSS; PIEZOELECTRIC FILM; THIN FILM BULK ACOUSTIC WAVE RESONATORS;

EID: 0030398681     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.1996.553130     Document Type: Conference Paper

References (4)

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3. L. Parameswaran, C. H. Hsu, and M. A. Schmidt. A merged MEMS-CMOS process using silicon wafer bonding. In IEDM Technical Digest, 1995.
4. K. M. Lakin, G. R. Kline, and K. T. McCarron. High-Q microwave acoustic resonators and filters. IEEE Trans. onMicrowave Theory and Techniques, 41(12):2139-2146, December 1993.