Surface-micromachined RF MEMs switches on GaAs substrates

International Journal of RF and Microwave Computer-Aided Engineering

Volumn 9, Issue 4, 1999, Pages 348-361

  Hyman, Daniel ^a,c,d,e   Lam, Juan ^{a,e,f,g,h,i,j}   Warneke, Brett ^{a,e,g,i,k,l,m}   Schmitz, Adele ^a,g,n   Hsu, T Y ^a,o,p   Brown, Julia ^a,q,r,s,t,u   Schaffner, James ^a,g,i   Walston, Andy ^a,g,v   Loo, Robert Y ^a,e,g   Mehregany, Mehran ^b,d,u,w   Lee, Jae ^b  

^a Hughes Aircraft Co   (United States)

^b Advanced MicroMachines Inc   (United States)

^c HARVEY MUDD COLLEGE   (United States)

^d CASE WESTERN RESERVE UNIVERSITY   (United States)

^e Case Western Reserve University ^*

^f NEW YORK UNIVERSITY   (United States)

^g UNIVERSITY OF CALIFORNIA   (United States)

^h OPTICAL SOCIETY OF AMERICA   (United States)

ⁱ IEEE

^j HEWLETT PACKARD COMPANY   (United States)

^k CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^l UNIVERSITY OF CALIFORNIA   (United States)

^m Berkeley Sensors and Actuators Ctr   (United States)

ⁿ PEPPERDINE UNIVERSITY   (United States)

^o STONY BROOK UNIVERSITY   (United States)

^p Gould Inc   (United States)

^q UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

^r UNIVERSAL DISPLAY CORPORATION   (United States)

^s Microelectronics Laboratory

^t Center for Software Engineering

^u LUCENT TECHNOLOGIES   (United States)

^v RAYTHEON COMPANY   (United States)

^w MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

more..

Author keywords

[No Author keywords available]

Indexed keywords

MICRORELAYS; MICROSWITCHES;

COMPUTER SIMULATION; ELECTRIC CURRENTS; ELECTROSTATICS; INSERTION LOSSES; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MILLIMETER WAVE DEVICES; OHMIC CONTACTS; SEMICONDUCTING GALLIUM ARSENIDE; SUBSTRATES;

SEMICONDUCTOR SWITCHES;

EID: 6544279672     PISSN: 10964290     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-047X(199907)9:4<348::AID-MMCE6>3.0.CO;2-K     Document Type: Article

References (19)

1. Hewlett Packard HSMP-382x series PIN diode data site, www.hp.com/HP-COMP/rf/sg/diodes/ hsmp382x.html.
2. X.Q. Sun et al., A bistable microrelay based on two-segment multimorph cantilever actuators, Proc MEMs '98, Heidelberg, Germany, 1998, pp. 154-159.
3. S. Zhou, X.Q. Sun, and W. Carr, A micro variable inductor chip using MEMs relays, Proc Transducers '97, 1997, pp. 1137-1140.
4. K. Petersen, Micromechanical membrane switches on silicon, IBM J Res Dev 23 (1979), 376-385.
5. L. Larson, R. Hackett, and R. Lohr, Microactuators for GaAs-based microwave integrated circuits, Proc Transducers '91, 1991, pp. 743-746.
6. R. Hackett, L. Larson, and M. Melendes, The integration of micro-machine fabrication with electronic device fabrication on III-V semiconductor materials, Proc Transducers '91, 1991, pp. 51-54.
7. S. Majumder, N. McGruer, P. Zavracky, G. Adams, R. Morrison, and J. Krim, Measurement and modeling of surface micromachined, electrostatically actuated microswitches, Proc Transducers '97, IEEE, 1997, pp. 1145-1148.
8. J. Yao and M. Chang, A surface micromachined miniature switch for telecommunications applications with signal frequencies from DC up to 4 GHz, Proc Transducers '95, 1995, pp. 384-387.
9. C. Goldsmith, J. Randall, S. Eshelman, T. Lin, D. Denniston, S. Chen, and B. Norvell, Characteristics of micromachined switches at microwave frequencies, Proc IEEE MTT-S, 1995, pp. 1141-1144.
10. C. Goldsmith, J. Randall, S. Eshelman, T.H. Lin, D. Denniston, S. Chen, and B. Norvell, Characteristics of micromachined switches at microwave frequencies, Proc IEEE MTT-S, 1996, pp. 1141-1144.
11. D. Hyman and M. Mehregany, Contact physics of gold microcontacts for MEMs switches, IEEE Trans Components & Manufacturing Technology, T.B.P., 1998.
12. H. Angus, Surface films on precious metal contacts, Brit J Appl Phys 13 (1962), 58-63.
13. S. Hannoe and H. Hosaka, Characteristics of electrical contacts used for microrelays, Proc Intl Symp Microsys Intel Mat and Robots, 1995, pp. 173-176.
14. J. Schimkat, Contact materials for microrelays, Proc MEMs '98, Heidelberg, Germany, 1998, pp. 190-193.
15. R. Morrissey, A versatile non-cyanide gold plating system, Plating Surf Finish, Apr. (1993), 75-79.
16. G.T. Mulhern, D.S. Soane, and R.T. Howe, Supercritical carbon dioxide drying of microstructures, Proceedings of the 7th international conference on solid-state sensors and actuators - TRANS-DUCERS '93, Yokohama, Japan, 1993, pp. 296-299.
17. S. Timoshenko and S. Woinowsky-Krieger, Theory of plates and shells, McGraw-Hill, New York, 1987.
18. M. Mehregany, W. Ko, A. Dewa, and C.C. Liu, Introduction to micro-electromechanical systems and the multiuser MEMs processes, Notes from CWRU/MCNC MEMs Short Course, Aug. 1993.
19. T.Y. Hsu, Fiber optic sensor sensing curvature of a diaphragm, U.S. Patent No. 5,446,279, Aug. 29, 1995.