SCOPUS 정보 검색 플랫폼

Volumn 3, Issue 1, 2002, Pages

RF-System-On-Package (SOP) for wireless communications

(10) Lim, Kyutae a Pinel, Stephane a Davis, Mekita a Sutono, Albert b Lee, Chang Ho b Heo, Deukhyoun c Obatoyinbo, Ade d Laskar, Joy a Tantzeris, Emmanouil M a Tummala, Rao a

a GEORGIA INSTITUTE OF TECHNOLOGY (United States)

b RF Solutions (United States)

c NATIONAL SEMICONDUCTOR CORPORATION (United States)

d HRL (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALUN; EMBEDDED PASSIVE LIBRARY; LOW-TEMPERATURE CO-FIRED CERAMIC PACKAGING; SYSTEM-ON-PACKAGE APPROACH;

ANTENNAS; CAPACITORS; ELECTRIC FILTERS; ELECTRIC INDUCTORS; MICROWAVES; MIM DEVICES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; POWER AMPLIFIERS; TRANSMITTERS; WIRELESS TELECOMMUNICATION SYSTEMS;

ELECTRONICS PACKAGING;

EID: 0036504490 PISSN: 15273342 EISSN: None Source Type: Trade Journal
DOI: 10.1109/MMW.2002.990700 Document Type: Article

Times cited : (167)

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12
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.