The integration of RF passives using thin-film technology on high-ohmic Si in combination with thick-film interconnect

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4587, Issue , 2001, Pages 467-470

  Van Beek, Joost ^a   Van Delden, Marc ^a   Jansman, Andre ^a   Boogaard, Arjen ^a   Kemmeren, Anton ^a   Pulsford, Nick ^a   Den Dekker, Arnold ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Passive integration; RF; Thick film; Thin film

Indexed keywords

CAPACITORS; CHEMICAL VAPOR DEPOSITION; ELECTRIC INDUCTORS; IMPEDANCE MATCHING (ELECTRIC); INSERTION LOSSES; INTERCONNECTION NETWORKS; Q FACTOR MEASUREMENT; SILICON NITRIDE; SPUTTERING; THICK FILM CIRCUITS; THIN FILM CIRCUITS;

PASSIVE INTEGRATION;

PASSIVE NETWORKS;

EID: 0035768598     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)