SoC or SoP? A balanced approach!

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 529-534

  Davidson, E ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; COST EFFECTIVENESS; MICROCOMPUTERS; MICROPROCESSOR CHIPS; MULTICHIP MODULES; RANDOM ACCESS STORAGE; TELEPHONE SETS;

FEW CHIP MODULES; SYSTEM ON A CHIP; WIRELESS HANDSETS;

SILICON ON SAPPHIRE TECHNOLOGY;

EID: 0034833274     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. International technology roadmap for semiconductors 1999 ed., system-on-a-chip chapter
2. The first IA-64 microprocessor
3. Power 4 focuses on memory bandwidth
4. Chip-package co-design for high-frequency circuits and systems
5. Facing size, cost issues, intel pared penthouse pentium 4
6. Large chip vs MCM for a high performance system
7. 3) and their impact upon large chip performance
8. Flip chip CPU package technology at intel: A technology and manufacturing overview
9. Passive go into hiding