Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 2001, Pages 921-924

  Tilmans, H A C ^a   Ziad, H ^a   Jansen, H ^a   Di Monaco, O ^a   Jourdain, A ^a   De Raedt, W ^a   Rottenberg, X ^a   De Backer, E ^a   Decaussemaeker, A ^a   Baert, K ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; LOW TEMPERATURE OPERATIONS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; ORGANIC COMPOUNDS; SILICON WAFERS; SUBSTRATES; WAVEGUIDES;

BENZOCYCLOBUTENE; METAL SURFACE MICROMACHINING PROCESS; RADIO FREQUENCY MICROELECTROMECHANICAL SYSTEM SWITCHES; WAFER-LEVEL PACKAGING SCHEME;

SEMICONDUCTOR SWITCHES;

EID: 0035714290     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Micromachined devices for wireless communications
2. RF MEMS from a device perspective
3. Low-loss CPW lines on surface stabilized high-resistivity silicon
4. Low temperature full wafer adhesive bonding of structured wafers