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Volumn 222, Issue 1, 2000, Pages 261-277

Impact of the unique physical properties of copper in silicon on characterization of copper diffusion barriers

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EID: 0034336196     PISSN: 03701972     EISSN: None     Source Type: Journal    
DOI: 10.1002/1521-3951(200011)222:1<261::AID-PSSB261>3.0.CO;2-5     Document Type: Article
Times cited : (23)

References (111)
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