Improvement of Ta diffusion barrier performance in Cu metallization by insertion of a thin Zr layer into Ta film

Applied Physics Letters

Volumn 72, Issue 22, 1998, Pages 2832-2834

  Kwak, Joon Seop ^a   Baik, Hong Koo ^a   Kim, Jong Hoon ^b   Lee, Sung Man ^b  

^a Yonsei University   (South Korea)

^b Kangwon National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000618313     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.121472     Document Type: Article

References (14)

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