Rapid thermal annealed Cr barrier against Cu diffusion

Journal of the Electrochemical Society

Volumn 146, Issue 7, 1999, Pages 2643-2647

  Chuang, Jui Chang ^a   Tu, Shuo Lun ^a   Chen, Mao Chieh ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHROMIUM; COPPER; DIODES; GRAIN BOUNDARIES; INTERDIFFUSION (SOLIDS); INTERFACES (MATERIALS); LEAKAGE CURRENTS; METALLIZING; RAPID THERMAL ANNEALING; SILICA;

BARRIER CAPABILITY; JUNCTION DIODES;

METALLIC FILMS;

EID: 0032631781     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391985     Document Type: Article

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