Sputter-deposited Mo and reactively sputter-deposited Mo-N films as barrier layers against Cu diffusion

Thin Solid Films

Volumn 346, Issue 1, 1999, Pages 299-306

  Chuang, Jui Chang ^a   Tu, Shuo Lun ^a   Chen, Mao Chieh ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; MOLYBDENUM; NITRIDES; SEMICONDUCTOR DIODES; SEMICONDUCTOR JUNCTIONS; SPUTTER DEPOSITION; THERMODYNAMIC STABILITY;

DIFFUSION BARRIER; MOLYBDENUM NITRIDE;

METALLIC FILMS;

EID: 0033149246     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)01728-3     Document Type: Article

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