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Volumn 612, Issue , 2000, Pages
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Materials, technology and reliability for advanced interconnects and low-k dielectrics
[No Author Info available]
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Author keywords
[No Author keywords available]
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Indexed keywords
CRYSTAL MICROSTRUCTURE;
DIELECTRIC DEVICES;
ELASTIC MODULI;
ELECTROMIGRATION;
GRAIN BOUNDARIES;
INTEGRATED CIRCUIT MANUFACTURE;
INTERFACES (MATERIALS);
PASSIVATION;
PERMITTIVITY;
REACTIVE ION ETCHING;
SEMICONDUCTOR DOPING;
SHEAR STRENGTH;
STRAIN MEASUREMENT;
STRESS ANALYSIS;
THERMAL CYCLING;
THIN FILMS;
ADHESION STRENGTH;
CUMULATIVE FAILURE DISTRIBUTIONS (CFD);
DAMASCENE INTERCONNECTS;
EIREV;
HIERARCHICAL FILTERING;
INTERFACE STRENGTH;
MECHANICAL INTEGRITY;
MULTI-LEVEL INTERCONNECTS;
ULTRASONIC FORCE MICROSCOPY (UFM);
X-RAY MICROBEAM DIFFRACTION;
DIELECTRIC MATERIALS;
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EID: 0034431007
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Review |
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Times cited : (10)
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References (0)
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