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Volumn 38, Issue 10, 1999, Pages 5792-5795

The effects of Cu diffusion in Cu/TiN/SiO2/Si capacitors

Author keywords

C v measurement; Cu metallization; Diffusion barrier; Interconnection; Tin

Indexed keywords

ANNEALING; CAPACITANCE MEASUREMENT; COPPER; DIFFUSION IN SOLIDS; ELECTRIC FIELD EFFECTS; METALLIZING; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE STRUCTURES; SILICA; STRESS ANALYSIS; TITANIUM NITRIDE; VOLTAGE MEASUREMENT;

EID: 0033334679     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.38.5792     Document Type: Article
Times cited : (12)

References (17)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.