![]() |
Volumn 38, Issue 10, 1999, Pages 5792-5795
|
The effects of Cu diffusion in Cu/TiN/SiO2/Si capacitors
|
Author keywords
C v measurement; Cu metallization; Diffusion barrier; Interconnection; Tin
|
Indexed keywords
ANNEALING;
CAPACITANCE MEASUREMENT;
COPPER;
DIFFUSION IN SOLIDS;
ELECTRIC FIELD EFFECTS;
METALLIZING;
SEMICONDUCTING SILICON;
SEMICONDUCTOR DEVICE STRUCTURES;
SILICA;
STRESS ANALYSIS;
TITANIUM NITRIDE;
VOLTAGE MEASUREMENT;
HIGH FREQUENCY CAPACITANCE-VOLTAGE (C-V) CHARACTERISTICS;
MOS CAPACITORS;
|
EID: 0033334679
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.38.5792 Document Type: Article |
Times cited : (12)
|
References (17)
|