Effect of TiN microstructure on diffusion barrier properties in Cu metallization

Journal of the Electrochemical Society

Volumn 145, Issue 6, 1998, Pages 2164-2178

  Kouno, Takahiro ^a   Niwa, Hideo ^a   Yamada, Masao ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; COPPER; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; METALLIZING; MICROSTRUCTURE; SPUTTER DEPOSITION;

COLUMNAR GRAINS;

TITANIUM NITRIDE;

EID: 0032097699     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838612     Document Type: Article

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