Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures

Journal of Materials Research

Volumn 12, Issue 12, 1997, Pages 3367-3372

  Rha, Sa Kyun ^a   Lee, Won Jun ^a   Lee, Seung Yun ^a   Kim, Dong Won ^a   Park, Chong Ook ^a   Chun, Soung Soon ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; INTERDIFFUSION (SOLIDS); MICROSTRUCTURE; SILICA; SILICON; SPUTTER DEPOSITION; TITANIUM; TITANIUM NITRIDE;

DIFFUSION BARRIERS;

MULTILAYERS;

EID: 0031355828     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1997.0441     Document Type: Article

References (16)