Copper damascene interconnection with tungsten silicon nitride diffusion barrier formed by electron cyclotron resonance plasma nitridation

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 38, Issue 4 B, 1999, Pages 2355-2359

  Hirata, Akihiko ^a   Machida, Katsuyuki ^a   Awaya, Nobuyoshi ^a,b   Kyuragi, Hakaru ^a   Maeda, Masahiko ^a  

^a NTT CORPORATION   (Japan)

^b SHARP CORPORATION   (Japan)

Author keywords

Copper damascene interconnection; Diffusion barrie; ECR plasma nitridation; WSiN

Indexed keywords

EID: 0000809245     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.38.2355     Document Type: Article

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