Thermal characteristic of sintered Ag-Cu nanopaste for high-temperature die-attach application

International Journal of Thermal Sciences

Volumn 87, Issue , 2015, Pages 169-177

  Tan, Kim Seah ^a   Wong, Yew Hoong ^b   Cheong, Kuan Yew ^a  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

^b UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

Coefficient of thermal expansion; Melting temperature; Performance index; Sintering; Thermal conductivity

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; COPPER COMPOUNDS; DIES; EXPANSION; FIBER OPTIC SENSORS; MELTING POINT; SILVER; SILVER ALLOYS; SINTERING; SPECIFIC HEAT; THERMAL EXPANSION;

CU LOADINGS; DIE-ATTACH; EXTERNAL PRESSURES; HIGH-TEMPERATURE DIE-ATTACH; NANO SIZED; PERFORMANCE INDICES; STRONG CORRELATION; THERMAL CHARACTERISTICS;

THERMAL CONDUCTIVITY;

EID: 84907486059     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2014.08.022     Document Type: Article

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