Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly

International Journal of Adhesion and Adhesives

Volumn 35, Issue , 2012, Pages 88-93

  Mei, Yunhui ^a   Chen, Gang ^a   Lu, Guo Quan ^a,b   Chen, Xu ^a  

^a TIANJIN UNIVERSITY   (China)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

Die attachment; Joint size; Low temperature sintering; Nano silver; Residual curvature

Indexed keywords

BENDING BEHAVIOR; COEFFICIENTS OF THERMAL EXPANSIONS; DIE-ATTACHMENT; LEAD FREE SOLDERS; LOW TEMPERATURES; LOW-TEMPERATURE SINTERING; NANO SILVER; ONE-DIMENSION; OPTICAL MEASUREMENT SYSTEMS; RESIDUAL CURVATURE; TEMPERATURE DIFFERENCES; THEORETICAL MODELS;

ALUMINA; FINITE ELEMENT METHOD; MEASUREMENTS; OPTICAL DATA PROCESSING; SINTERING; TEMPERATURE;

SILVER;

EID: 84862812391     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2011.12.010     Document Type: Article

References (30)

1. Lu GQ, Kromann GB, Mogilevsky B, et al. Evaluation of die-attach adhesives by curvature measurements in: InterSociety Conference on Thermal Phenomena in Electronic Systems, Austin, TX, 1992 pp. 155-158.
2. Beckedahl P, Grasshoff T, and Lederer M. A new power module concept for automotive applications in: International Exhibition & Conference for Power Electronics Intelligent Motion Power Quality or PCIM, Nuremberg, Germany, 2007, pp. 1-5.
3. Y. Mei, X. Chen, and H. Gao Hygrothermal effects on the tensile properties of anisotropic conductive films J. Electron. Mater. 38 2009 2415 2426
4. Z. Zhang, and G.-Q. Lu Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow IEEE Trans. Electron. Packag. Manuf. 25 2002 279 283
5. Amro R, Lutz J, Rudzki J, et al. Power cycling at high temperature swings of modules with low-temperature joining technique in: Proceedings of the 18th International Symposium on Power Semiconductor Devices & ICs, Naples, Italy, 2006, pp. 217-220.
6. Scheuermann U and Wiedl. PLow-temperature joining technology - a high reliability alternative to solder contacts. In: Workshop on Metal Ceramic Composites for Functional Applications, Wien, 1997, pp. 181-192.
7. Schwarzbauer H. Method of securing electronic components to a substrate Fed. Rep. of Germany Patent, 1989.
8. Göbl C, Beckedahl P, and Braml H. Low-temperature sinter technology die-attachment for automotive power electronic applications. In: Automotive Power Electronics, Paris, 2006, pp. 1-5.
9. A.D. Albert, M.F. Becker, and J.W. Keto Low-temperature, pressure-assisted sintering of nanoparticulate silver films Acta Mater. 56 2008 1820 1829
10. Knoerr M, Kraft S, Schletz A. Reliability assessment of sintered nano-silver die-attachment for power semiconductors. In: Proceedings of the Electronics Packaging Technology Conference (EPTC); 2010. p. 56-61.
11. T. Wang, X. Chen, and G.-Q. Lu Low-temperature sintering with nano-silver paste in die-attached interconnection J. Electron. Mater. 36 2007 1333 1340
12. J.G. Bai, and L. Guo-Quan Thermomechanical reliability of low-temperature sintered silver die-attached SiC power device assembly IEEE Trans. Device Mater. Reliab. 6 2006 436 441
13. J.N. Calata, T.G. Lei, and G.Q. Lu Sintered nano-silver paste for high-temperature power semiconductor device attachment Int. J. Mater. Prod. Technol. 34 2009 95 110
14. J.G. Bai, T.G. Lei, and J.N. Calata Control of nano-silver sintering attained through organic binder burnout J. Mater. Res. 22 2007 3494 3500
15. J.G. Bai, Z.Z. Zhang, and J.N. Calata Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material IEEE Trans. Compon. Packag. Technol. 29 2006 589 593
16. Y. Yu, I.A. Ashcroft, and G. Swallowe An experimental investigation of residual stresses in an epoxy-steel laminate Int. J. Adhes. Adhes. 26 2006 511 519
17. F.S. Jumbo, I.A. Ashcroft, and A.D. Crocombe Thermal residual stress analysis of epoxy bi-material laminates and bonded joints Int. J. Adhes. Adhes. 30 2010 523 538
18. Knoerr M, Kraft S, Schletz A. Reliability assessment of sintered nano-silver die-attachment for power semiconductors. In: Proceedings of the 12th Electronics Packaging Technology Conference Singapore.
19. 2) chips IEEE Trans. Compon. Packag. Technol. 33 2010 98 104
20. Y.-H. Mei, G.-Q. Lu, and X. Chen Migration of sintered nano-silver die-attach material on alumina substrate between 250 °C and 400 °C in dry air IEEE Trans. Device Mater. Reliab. 11 2011 316 322
21. Y.-H. Mei, G.-Q. Lu, and X. Chen Effect of oxygen partial pressure on silver migration of low-temperature sintered nano-silver die-attach material IEEE Trans. Device Mater. Reliab. 11 2011 312 315
22. K. Qi, X. Chen, and G.Q. Lu Effect of interconnection area on shear strength of sintered joint with nano-silver paste Soldering Surf. Mount Technol. 20 2008 8 12
23. Y.H. Mei, G.Q. Lu, and X. Chen Investigation of post-etch copper residue on direct bonded copper (DBC) substrates J. Electron. Mater. 40 2011 2119 2125
24. 3 multi-layered material Mater. Sci. Eng., A 205 1996 59 71
25. T.G. Lei, J. Calata, and S.F. Luo Low-temperature sintering of nanoscale silver paste for large-area joints in power electronics modules Key Eng. Mater. 353-358 2007 2948 2953
26. 2) chips IEEE Trans. Compon. Packag. Technol. 33 2010 98 104
27. A.A. Taib, R. Boukhili, and S. Achiou Bonded joints with composite adherends. Part II. Finite element analysis of joggle lap joints Int. J. Adhes. Adhes. 26 2006 237 248
28. K. Suganuma, T. Okamoto, and M. Koizumi Influence of shape and size on residual stress in ceramic/metal joining J. Mater. Sci. 22 1987 3561 3565
29. C. Sato Stress estimation of joints having adherends with different curvatures bonded with viscoelastic adhesives Int. J. Adhes. Adhes. 31 2011 315 321
30. L. Tong, and X. Sun Nonlinear stress analysis for bonded patch to curved thin-walled structures Int. J. Adhes. Adhes. 23 2003 349 364