Low Processing Temperature of Lead-Free Solder Interconnects

IEEE Nanotechnology Magazine

Volumn 4, Issue 2, 2010, Pages 20-23

  Jiang, Hongjin ^a   Wong, C P ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COPPER SURFACE; DIFFERENT SIZES; INTERCONNECT APPLICATIONS; INTERMETALLIC COMPOUNDS; LATENT HEAT OF FUSION; LEAD FREE SOLDERS; LOW PROCESSING TEMPERATURE; REFLOW PROCESS; SNAGCU ALLOYS; THERMAL PROPERTIES; TIN-COPPER;

DIFFERENTIAL SCANNING CALORIMETRY; NANOPARTICLES; PROCESSING; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TEMPERATURE;

LEAD;

EID: 77953160277     PISSN: 19324510     EISSN: None     Source Type: Journal    
DOI: 10.1109/MNANO.2010.936604     Document Type: Article

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