A novel silver-aluminium high-temperature die attach nanopaste system: The effects of organic additives content on post-sintered attributes

Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 8, 2013, Pages 2678-2688

  Manikam, Vemal Raja ^a   Razak, Khairunisak Abdul ^a   Cheong, Kuan Yew ^a  

^a SCHOOL OF CHEMICAL ENGINEERING   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

DIE-ATTACH MATERIALS; ELECTRICAL CONDUCTIVITY; HIGH TEMPERATURE; HIGH-TEMPERATURE DIE-ATTACH; ORGANIC ADDITIVES; ORGANIC CONTENT; SOLDER ALLOYS; WEIGHT PERCENT;

ALUMINUM; ELECTRIC CONDUCTIVITY; HIGH TEMPERATURE APPLICATIONS; MATERIALS; NANOPARTICLES; SILVER ALLOYS; SINTERING;

SILVER;

EID: 84881480481     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-013-1155-9     Document Type: Article

References (77)

1. V.R. Manikam, K.Y. Cheong, IEEE Trans. Compon. Packag. Technol. 1, 457 (2011)
2. H.S. Chin, K.Y. Cheong, A.B. Ismail, Met. Mat. Trans. B 41, 824 (2010)
3. J. Homberger, A.B. Lostetter, K.J. Olejniczak, T. McNutt, S.M. Lal, A. Mantooth, Proc. IEEE Aerosp. Conf. 4, 2538 (2004)
4. J.N. Lalena, N.F. Dean, M.W. Weiser, in Proc. Honeywell Electron. Mater. 131th Annu. TMS Meet Exhibit., 1 (2002)
5. A. Hartnett, S. Buerki, in Proc. 42nd IMAPS, 281 (2009)
6. R. Kisiel, Z. Szczepánski, Microelectron. Rel. 49, 627 (2009)
7. K. Suganuma, Lead free soldering in electronics: science, technology, and environmental impact (Marcel Dekker, New York, 2004)
8. W.J. Plumbridge, R.J. Matela, A. Westwater, Structural integrity and reliability in electronics enhancing performance in a lead-free environment (Springer, New York, 2004)
9. M. Abtew, G. Selvaduray, Mater. Sci. Eng. R 27, 95 (2000)
10. V. Krishnamurthy, K. Paik, D. Lester, in Proc. ISHM, 719 (1992)
11. S.J. Kim, K.S. Kim, S.S. Kim, K. Suganuma, J. Electron. Mater. 38, 266 (2009)
12. J.E. Lee, K.S. Kim, K. Suganuma, M. Inoue, G. Izuta, Mater. Trans. 48, 584 (2007)
13. S.H. Wang, T.S. Chin, C.F. Yang, S.W. Chen, C.T. Chuang, J. Alloys Compd. 497, 428 (2010)
14. M.N. Islam, Y.C. Chan, M.J. Rizvi, W. Jillek, J. Alloys Compd. 400, 136 (2005)
15. Z. Zhang, G.Q. Lu, IEEE Trans. Electron. Packag. Manuf. 25, 279 (2002)
16. K. Meyyappan, P. McCluskey, L.Y. Chen, IEEE Trans. Device Mater. Rel. 3, 152 (2003)
17. Y.V. Naidich, V. Zhuravlev, N. Krasovskaya, Mater. Sci. Eng. A 245, 293 (1998)
18. K. Suganuma, S.J. Kim, K.S. Kim, J. Miner. Met. Mat. Soc. 61, 64 (2009)
19. P. Hagler, P. Henson, R.W. Johnson, IEEE Trans. Ind. Electron. 58, 2673 (2011)
20. V. Chidambaram, J. Hald, J. Hattel, J. Alloys Compd. 490, 170 (2010)
21. C.L. Chin, Y.W. Chen, G. Matijasevic, IEEE Trans. Compon. Hybrids Manuf. Technol. 16, 311 (1993)
22. J.Z. Shi, X.M. Xie, F. Stubhan, J. Freytag, J. Electron. Packag. 122, 168 (2000)
23. W.C. Ricky, C.L. Chin, IEEE Trans. Compon. Packag. Technol. 25, 453 (2002)
24. J.G. Bai, J. Yin, Z.Z. Zhang, G.Q. Lu, J.D. van Wyk, IEEE Trans. Adv. Packag. 30, 506 (2007)
25. J.G. Bai, Z.Z. Zhang, J.N. Calata, G.Q. Lu, IEEE Trans. Compon. Packag. Technol. 29, 589 (2006)
26. J.G. Bai, T.G. Lei, J.N. Calata, G.Q. Lu, IEEE Trans. Electron. Packag. Manuf. 30, 241 (2007)
27. G.Q. Lu, J.N. Calata, G. Leia, X. Chen, in Proc. 8th Int. Conf. Therm. Mech. Multiphys. Sim. Exp. Micro-Electron. Micro-Syst., 1 (2007)
28. G.Q. Lu, J.N. Calata, Z. Zhang, J.G. Bai, in Proc. 6th IEEE CPMT Conf. HDP, 42 (2004)
29. D. Wakuda, M. Hatamura, K. Suganuma, Chem. Phys. Lett. 441, 305 (2007)
30. D. Wakuda, K.S. Kim, K. Suganuma, Scripta Mater. 59, 649 (2008)
31. T. Niizeki, K. Maekawa, M. Mita, K. Yamasaki, Y. Matsuba, N. Terada, H. Saito, in Proc. 58th ECTC, 1745 (2008)
32. K.S. Siow, J. Alloys Compd. 514, 6 (2011)
33. J. Liu, X. Li, X. Zeng, J. Alloys Compd. 494, 84 (2010)
34. J.R. Groza, A. Zavaliangos, Rev. Adv. Mater. Sci. 5, 24 (2003)
35. J.R. Groza, Nanostr. Mater. 12, 987 (1999)
36. X. Cao, T. Wang, K.D.T. Ngo, G.Q. Lu, IEEE Trans. Electron. Packag. Manuf. Technol. 1, 495 (2011)
37. W.D. Callister Jr, Materials Science and Engineering: An Introduction, 5th edn. (Wiley, New York, 2000)
38. M. Kearns, Mater. Sci. Eng. A 375, 120 (2004)
39. V.R. Manikam, K.Y. Cheong, K.A. Razak, Mater. Sci. Eng. B 176, 187 (2011)
40. S. Link, Z.L. Wang, M.A. El-Sayed, J. Phys. Chem. B 103, 3529 (1999)
41. H.M. Chen, C.F. Hsin, R.S. Liu, J.F. Lee, L.Y. Jang, J. Phys. Chem. C 111, 5909 (2007)
42. H. Jiang, K.S. Moon, C.P. Wong, Int. Symp. Proc. Adv. Packag. Mater. 173 (2005)
43. D.P. Dutta, G. Sharma, A.K. Rajarajan, S.M. Yusuf, G.K. Dey, Chem. Mater. 19, 1221 (2007)
44. K.E. Gonsalves, S.P. Rangarajan, J. Wang, in Handbook of Nanostructured Materials and Nanotechnology, ed. by H.S. Nalwa (Academic Press, San Diego 2000)
45. Z. Liu, D.D.L. Chung, J. Electron. Packag. 123, 64 (2001)
46. M. Zhu, D.D.L. Chung, J. Electron. Mater. 23, 541 (1994)
47. A. Adlabnig, J.C. Schuster, R. Reicher, W. Smetana, J. Mater. Sci. 33, 4487 (1998)
48. V.R. Manikam, K.A. Razak, K.Y. Cheong, IEEE Trans. Adv. Packag. 2, 1940 (2012)
49. J.G. Bai, T.G. Lei, J.N. Calata, G.Q. Lu, J. Mater. Res. 22, 3494 (2007)
50. G.P. Zhigal'skii, B.K. Jones, The Physical Properties of Thin Metal Films (Taylor and Francis, New York, 2003)
51. P. Powen, C. Carry, Powder Tech. 128, 248 (2000)
52. C. Zou, Y. Gao, B. Yang, Q. Zhai, J. Mater. Sci. Mater. Electron. 21, 868 (2010)
53. J. Sun, S.L. Simon, Thermochim. Acta 463, 32 (2007)
54. S.S. Zhang, Y.J. Zhang, H.W. Wang, Mater. Design 31, 594 (2010)
55. L. Bergstrom, Coll. Surf. A 133, 151 (1998)
56. M.M. Cross, J. Coll. Int. Sci. 33, 30 (1970)
57. R. Durairaj, S. Mallik, A. Seman, A. Marks, N.N. Ekere, J. Mater. Proc. Technol. 209, 3923 (2009)
58. R. Durairaj, S. Mallik, N.N. Ekere, Solder. Surf. Mt. Technol. 20, 34 (2008)
59. Y. Tian, Y.C. Chan, J.K.L. Lai, S.T.F. Pak, IEEE Trans. Compon. Packag. Manuf. Technol. B 20, 146 (1997)
60. B. Rellinghaus, S. Stappert, E.F. Wassermann, H. Sauer, B. Spliethoff, Eur. Phys. J. D 16, 249 (2001)
61. H. Wang, L. Huang, Z. Xu, C. Xu, R.J. Composto, Scholarly commons Dept. papers, University of Pennsylvania, 1 (2008)
62. T. Noda, T. Mano, N. Koguchi, Appl. Surf. Sci. 252, 5408 (2006)
63. I. Yamauchi, T. Kajiwara, T. Mase, M. Saraoka, J. Alloys Compd. 336, 206 (2002)
64. T.R. Northen, H.K. Woo, M.T. Northen, A. Nordström, W. Uritboonthail, K.L. Turner, G. Siuzdak, J. Am. Soc. Mass Spectrum 18, 1945 (2007)
65. K. Lafdi, O. Mesalhy, S. Shaikh, J. Appl. Phys. 102, 083549 (2007)
66. A.C.T. Tang, P.M. Sargent, Electron. Lett. 27, 2018 (1991)
67. H. Jiang, K.S. Moon, C.P. Wong, Electron. Comp. Tech. Conf. 1400 (2008)
68. H. Jiang, K.S. Moon, F. Hua, C.P. Wong, Chem. Mater. 19, 4482 (2007)
69. C.D. Zou, Y.L. Gao, B. Yang, Q.J. Zhai, Solder. Surf. Mt. Technol. 21, 9 (2009)
70. S.W. Chen, C.C. Lin, C.M. Chen, Met. Mater. Trans. A 29A, 1965 (1998)
71. T. Wang, X. Chen, G.Q. Lu, G.Y. Lei, J. Electron. Mater. 36, 1333 (2007)
72. Y. Goueffo, C. Mabru, M. Labarrére, L. Arurault, C. Tonon, P. Guigue, Surf. Coat. Technol. 205, 2643 (2010)
73. Y. Kuru, M. Wohlschlögel, U. Welzel, E.J. Mittemeijer, Appl. Phys. Lett. 90, 243113 (2007)
74. A.A. Nuzhdin, Powder Met. Met. Ceram. 31, 1022 (1992)
75. Z.H. Shui, R. Zhang, W. Chen, D. Xuan, Construct. Build Mat. 24, 1761 (2010)
76. V.R. Manikam, K.A. Razak, K.Y. Cheong, J. Mater. Sci. Mater. Electron. doi: 10.1007/s10854-012-0801-y (2012)
77. V.R. Manikam, K.A. Razak, K.Y. Cheong, Micron. Rel. doi: 10.1016/j.microrel.2012.10.007 (2012)