Preparation and low-temperature sintering of Cu nanoparticles for high-power devices

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 4, 2012, Pages 587-592

  Krishnan, Shutesh ^a   Haseeb, A S M A ^a   Johan, Mohd Rafie ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

Cu nanoparticles; high temperature device; lead free; low temperature sintering; pulsed wire evaporation

Indexed keywords

BONDED INTERFACE; CROSS-SECTION ANALYSIS; CU NANOPARTICLES; ELECTRICAL RESISTANCES; FORMING GAS; HIGH TEMPERATURE ELECTRONIC DEVICES; HIGH-POWER DEVICES; HIGH-TEMPERATURE DEVICES; HIGH-TEMPERATURE ELECTRONICS; IN-SITU; INTERCONNECT MATERIALS; LEAD-FREE; LOW-TEMPERATURE SINTERING; ORGANIC MIXTURES; OXIDE REDUCTION; SILICON DIE;

ELECTRONICS PACKAGING; EVAPORATION; PHASE TRANSITIONS; SINTERING; SOLVENT EXTRACTION; TEMPERATURE; WIRE;

NANOPARTICLES;

EID: 84859748632     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2189208     Document Type: Article

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