Effect of die-attach materials and thickness on the reliability of HP-LED

Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013

Volumn , Issue , 2013, Pages 1048-1052

  Weng, Fei ^a   Song, Peng ^a   Zhang, Jinlong ^a   Zhang, Jianhua ^a   Yin, Luqiao ^a  

^a SHANGHAI UNIVERSITY   (China)

Author keywords

Die attach Material; HP LED; Reliability; Thermal Resistance

Indexed keywords

DIES; DURABILITY; ELECTRONICS PACKAGING; HEAT RESISTANCE; LIGHT EMITTING DIODES; RELIABILITY;

DIE-ATTACH MATERIALS; FINITE ELEMENT ANALYSIS SOFTWARE; HP-LED; INFLUENCING MECHANISMS; INTERCONNECT LAYERS; INTERCONNECT MATERIALS; JUNCTION TEMPERATURES; THERMAL PERFORMANCE;

THERMAL CONDUCTIVITY;

EID: 84898050525     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2013.6756639     Document Type: Conference Paper

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