Thermal properties and wetting behavior of high temperature Zn-Al-in solders

Journal of Materials Engineering and Performance

Volumn 21, Issue 5, 2012, Pages 599-605

  Gancarz, Tomasz ^a   Pstruś, Janusz ^a   Fima, Przemysław ^a   Mosińska, Sylwia ^b  

^a INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^b WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Microstructure; Thermal properties; Wetting; Zn Al In alloys

Indexed keywords

ALUMINUM ALLOYS; BINARY ALLOYS; EUTECTICS; MELTING POINT; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THERMAL EXPANSION; THERMODYNAMIC PROPERTIES; WETTING; X RAY ANALYSIS;

ELECTRON DISPERSIVE X-RAY ANALYSIS; EUTECTIC ALLOYS; HIGH TEMPERATURE; SESSILE DROP METHOD; SOLIDIFIED ALLOYS; TEMPERATURE RISE; ULTRAHIGH TEMPERATURE; WETTING BEHAVIOR;

ZINC ALLOYS;

EID: 84862222856     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-012-0146-y     Document Type: Article

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