Post-CMOS and post-MEMS compatible flexible skin technologies: A review

IEEE Sensors Journal

Volumn 13, Issue 10, 2013, Pages 3962-3975

  Xu, Yong ^a  

^a Wayne State University   (United States)

Author keywords

Flexible electronics; sensor arrays; silicon on insulator technology; wearable sensors

Indexed keywords

COMMON STRUCTURES; FLEXIBLE DEVICE; FLEXIBLE SUBSTRATE; HIGH TEMPERATURE MEMS; INTERCONNECTION METHOD; MONOLITHIC INTEGRATION; POST PROCESSING; WEARABLE SENSORS;

CMOS INTEGRATED CIRCUITS; SENSOR ARRAYS; SENSORS; SILICON; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; TECHNOLOGY;

FLEXIBLE ELECTRONICS;

EID: 84883790746     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2013.2262375     Document Type: Review

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