A flexible mixed-signal/RF CMOS technology for implantable electronics applications

Journal of Micromechanics and Microengineering

Volumn 20, Issue 4, 2010, Pages

  Hsieh, C Y ^a   Chen, C S ^b   Tsou, W A ^b   Yeh, Y T ^a   Wen, K A ^b   Fan, L S ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRESS; BIOCOMPATIBLE MATERIALS; CMOS (COMPLEMENTARY METAL OXIDE SEMICONDUCTOR); CMOS TECHNOLOGY; ELECTRONICS APPLICATIONS; FLEXIBLE DEVICE; FULLY INTEGRATED; IC CHIPS; INTEGRATED CIRCUIT CHIPS; LOW PHASE NOISE; MOS TRANSISTORS; PARYLENE C; POST-CMOS; POST-PROCESSING TECHNOLOGIES; RF-CMOS; RING OSCILLATOR; SILICON ON INSULATOR; VOLTAGE CONTROLLED OSCILLATOR;

BIOLOGICAL MATERIALS; FLEXIBLE ELECTRONICS; INTEGRATED CIRCUITS; METALLIC COMPOUNDS; MOS DEVICES; OSCILLATORS (ELECTRONIC); SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; TRANSISTOR TRANSISTOR LOGIC CIRCUITS;

CMOS INTEGRATED CIRCUITS;

EID: 77949894686     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/4/045017     Document Type: Article

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