Underwater flexible shear-stress sensor skins

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 833-836

  Xu, Yong ^a   Clendenen, Jason ^b   Tung, Steve ^b   Jiang, Fukang ^c   Tai, Yu Chong ^d  

^a Wayne State University   (United States)

^b 3202 Bell Engineering Center   (United States)

^c Umachines Inc   (United States)

^d California Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; PASSIVATION; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; SILICON WAFERS; SPUTTERING; STRESS CONCENTRATION;

FLOW INTERFERENCE; SHEAR-STRESS SENSORS; WATER TUNNELS;

SENSORS;

EID: 3042737895     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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