A biocompatible and flexible rf CMOS technology and the characterization of the flexible mos transistors under bending stresses

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2009, Pages 627-629

  Hsieh, C Y ^a   Chen, J S ^b   Tsou, W A ^b   Yeh, Y T ^a   Wen, K A ^b   Fan, L S ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ARTIFICIAL RETINAS; BENDING STRESS; CMOS PROCESS; FLEXIBLE ELECTRONIC DEVICES; IMPLANTABLE MICROSYSTEMS; MECHANICAL STRESS; MEDICAL IMPLANTS; MOS TRANSISTORS; PARYLENE; RF CMOS TECHNOLOGY; SILICON ON INSULATOR; SILICON SUBSTRATES; TRANSVERSE DIRECTIONS; WIRELESS SENSOR;

CARRIER MOBILITY; CMOS INTEGRATED CIRCUITS; MOSFET DEVICES; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; STRESSES; TRANSISTOR TRANSISTOR LOGIC CIRCUITS;

SILICON ON INSULATOR TECHNOLOGY;

EID: 65949123165     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2009.4805460     Document Type: Conference Paper

References (2)

1. C.Y. Hsieh, W.A. Tsou, Y.T. Yeh, K.A. Wen, L.S. Fan, Proc. APCOT 2008, pp. 746-748.
2. R. Dekker, M.H.W.A. van Deurzen, W.van der. Einden, H.G.R. Mass, and A.G. Wagemans, "A low-cost substrate transfer technology for fully integrated transceivers," in Proc-IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 1998, pp. 132-135.