Fabrication of large-area three-dimensional microstructures on flexible substrates by microtransfer printing methods

Journal of Microelectromechanical Systems

Volumn 21, Issue 3, 2012, Pages 749-755

  Huang, Chi Chieh ^a   Zeng, Xuefeng ^a,b   Jiang, Hongrui ^a  

^a University of Wisconsin Madison   (United States)

^b Hermes Microvision Inc   (United States)

Author keywords

Flexible substrates; high aspect ratio; nonplanar surfaces; peeling microprinting method; three dimensional (3 D) microstructures; transfer printing

Indexed keywords

FLEXIBLE SUBSTRATE; HIGH ASPECT RATIO; MICROPRINTING; NON-PLANAR SURFACES; THREEDIMENSIONAL (3-D); TRANSFER PRINTING;

ASPECT RATIO; ELECTROMECHANICAL DEVICES; FABRICATION; MEMS; MICROCHANNELS; MICROSTRUCTURE; PRINTING; SILICONES; STRESS ANALYSIS; THREE DIMENSIONAL; TWO DIMENSIONAL;

SUBSTRATES;

EID: 84862785343     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2012.2184085     Document Type: Article

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