Wafer-level parylene packaging with integrated rf electronics for wireless retinal prostheses

Journal of Microelectromechanical Systems

Volumn 19, Issue 4, 2010, Pages 735-742

  Li, Wen ^a   Rodger, Damien C ^b   Meng, Ellis ^c   Weiland, James D ^c   Humayun, Mark S ^b   Tai, Yu Chong ^d  

^a Michigan State University   (United States)

^b UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

^c California Institute of Technology ^*  (United States)

^d California Institute of Technology   (United States)

Author keywords

Accelerated lifetime soak testing (ALST); chip packaging; Parylene C; radio frequency (RF) coil

Indexed keywords

BIOMEDICAL APPLICATIONS; BODY TEMPERATURE; CHIP INTEGRATION; CHIP PACKAGING; COATED METALS; DATA TRANSMISSION; ELEVATED TEMPERATURE; MEMS COILS; MICROELECTROMECHANICAL SYSTEMS; MICROFABRICATED; OPERATING FREQUENCY; PACKAGING PERFORMANCE; PACKAGING TECHNOLOGIES; PARYLENE C; PARYLENES; RADIO-FREQUENCY COIL; RETINAL PROSTHESIS; RF ELECTRONICS; RF IDENTIFICATIONS; RFID CHIPS; RFID READERS; SILICON CHIP; SOAK TESTING; THIN-FILM TECHNOLOGY; TWO LAYERS; WAFER LEVEL;

COMPOSITE MICROMECHANICS; ELECTRONIC EQUIPMENT MANUFACTURE; EMBEDDED SYSTEMS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; PACKAGING; PACKAGING MATERIALS; PROSTHETICS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

CHIP SCALE PACKAGES;

EID: 77955358821     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2049985     Document Type: Article

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