-
1
-
-
0002575093
-
Tactile sensing for mechatronics-A state of the art survey
-
Lee M H and Nicholls H R 1999 Tactile sensing for mechatronics-a state of the art survey Mechatronics 9 1-33
-
(1999)
Mechatronics
, vol.9
, pp. 1-33
-
-
Lee, M.H.1
Nicholls, H.R.2
-
3
-
-
0034467107
-
A traction stress sensor array for use in high-resolution robotic tactile imaging
-
Kane B J, Cutkosky M R and Kovacs T A 2000 A traction stress sensor array for use in high-resolution robotic tactile imaging J. Microelectromech. Syst. 9 425-34
-
(2000)
J. Microelectromech. Syst.
, vol.9
, pp. 425-434
-
-
Kane, B.J.1
Cutkosky, M.R.2
Kovacs, T.A.3
-
7
-
-
0034275863
-
New tactile sensor chip with silicone rubber cover
-
Leineweber M, Pelz G, Schmidt M, Kappert H and Zimmer G 2000 New tactile sensor chip with silicone rubber cover Sensors Actuators A 84 236-245
-
(2000)
Sensors Actuators A
, vol.84
, pp. 236-245
-
-
Leineweber, M.1
Pelz, G.2
Schmidt, M.3
Kappert, H.4
Zimmer, G.5
-
8
-
-
0029325754
-
Object imaging with a piezoelectric robotic tactile sensor
-
Kolesar E S and Dyson C S 1995 Object imaging with a piezoelectric robotic tactile sensor J. Microelectromech. Syst. 4 87-96
-
(1995)
J. Microelectromech. Syst.
, vol.4
, pp. 87-96
-
-
Kolesar, E.S.1
Dyson, C.S.2
-
10
-
-
0025592323
-
Robotic tactile sensor array fabricated from a piezoelectric polyvinylidene fluoride film
-
Reston R R and Kolesar E S 1990 Robotic tactile sensor array fabricated from a piezoelectric polyvinylidene fluoride film Proc. 1990 IEEE NAECON vol 3 pp 1139-44
-
(1990)
Proc. 1990 IEEE NAECON
, vol.3
, pp. 1139-1144
-
-
Reston, R.R.1
Kolesar, E.S.2
-
12
-
-
0036122135
-
A new type of tactile sensor detecting contact force and hardness of an object 2002
-
Shimizu T, Shikida M, Sato K and Itoigawa K 2002 A new type of tactile sensor detecting contact force and hardness of an object 2002 Proc. 2002 IEEE Conf. on MEMS vol 1 pp 344-7
-
(2002)
Proc. 2002 IEEE Conf. on MEMS
, vol.1
, pp. 344-347
-
-
Shimizu, T.1
Shikida, M.2
Sato, K.3
Itoigawa, K.4
-
14
-
-
0030645994
-
A flexible MEMS technology and its first application to shear stress sensor skin
-
Jiang F, Tai Y-C, Walsh K, Tsao T, Lee G-B and Ho C-M 1997 A flexible MEMS technology and its first application to shear stress sensor skin Proc. 1997 IEEE Int. Conf. on MEMS pp 465-70
-
(1997)
Proc. 1997 IEEE Int. Conf. on MEMS
, pp. 465-470
-
-
Jiang, F.1
Tai, Y.-C.2
Walsh, K.3
Tsao, T.4
Lee, G.-B.5
Ho, C.-M.6
-
15
-
-
0028463941
-
A flexible polyimide-based package for silicon sensors
-
Beebe D J and Denton D D 1994 A flexible polyimide-based package for silicon sensors Sensors Actuators A 44 57-64
-
(1994)
Sensors Actuators A
, vol.44
, pp. 57-64
-
-
Beebe, D.J.1
Denton, D.D.2
-
17
-
-
0036124070
-
SU-8 based piezoresistive mechanical sensor
-
Thaysen J, Yalcinkaya A D, Vestergaard R K, Jensen S, Mortensen M W, Vettiger P and Menon A 2002 SU-8 based piezoresistive mechanical sensor Proc. 2002 IEEE Int. Conf. on MEMS pp 320-3
-
(2002)
Proc. 2002 IEEE Int. Conf. on MEMS
, pp. 320-323
-
-
Thaysen, J.1
Yalcinkaya, A.D.2
Vestergaard, R.K.3
Jensen, S.4
Mortensen, M.W.5
Vettiger, P.6
Menon, A.7
-
18
-
-
0006680108
-
Sub-micron solid-state adhesive bonding with aromatic thermosetting copolyesters for the transfer and assembly of microfabricated PMDA-ODA polyimide membranes
-
MSc Thesis University of Illinois at Urbana-Champaign
-
Selby J C 2001 Sub-micron solid-state adhesive bonding with aromatic thermosetting copolyesters for the transfer and assembly of microfabricated PMDA-ODA polyimide membranes MSc Thesis University of Illinois at Urbana-Champaign
-
(2001)
-
-
Selby, J.C.1
-
19
-
-
0030382632
-
Effect of oxygen plasma etching on adhesion between polyimide films and metal
-
Nakamura Y, Suzuki Y and Watanabe Y 1996 Effect of oxygen plasma etching on adhesion between polyimide films and metal Thin Solid Films 290-291 367-9
-
(1996)
Thin Solid Films
, vol.290-291
, pp. 367-369
-
-
Nakamura, Y.1
Suzuki, Y.2
Watanabe, Y.3
-
20
-
-
0033336780
-
Processing thick multilevel polyimide films for 3-D stacked memory
-
Caterer M D, Daubenspeck T H, Ference T G, Holmes S J and Quinn R M 1999 Processing thick multilevel polyimide films for 3-D stacked memory IEEE Trans. Adv. Packag. 22 189-99
-
(1999)
IEEE Trans. Adv. Packag.
, vol.22
, pp. 189-199
-
-
Caterer, M.D.1
Daubenspeck, T.H.2
Ference, T.G.3
Holmes, S.J.4
Quinn, R.M.5
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