Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

International Journal of Adhesion and Adhesives

Volumn 44, Issue , 2013, Pages 232-236

  Cui, Hui Wang ^a,b,c   Li, Dong Sheng ^a   Fan, Qiong ^a   Lai, Hua Xiang ^a  

^a SHANGHAI UNIVERSITY   (China)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^c OSAKA UNIVERSITY   (Japan)

Author keywords

Conductive adhesives; Electronics; Mechanical properties of adhesives

Indexed keywords

CONDUCTIVE ADHESIVE; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICALLY CONDUCTIVE ADHESIVES; HIGH RELIABILITY; MATRIX RESIN; MECHANICAL PROPERTIES OF ADHESIVES; NITRIDE PARTICLES;

ATMOSPHERIC HUMIDITY; BORON NITRIDE; ELECTRONIC EQUIPMENT; MECHANICAL PROPERTIES; THERMAL AGING;

SILVER;

EID: 84876462848     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2013.03.007     Document Type: Article

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