Electrically Conductive Epoxy Adhesives

Polymers

Volumn 3, Issue 1, 2011, Pages 427-466

  Sancaktar, Erol ^a   Bai, Lan ^a  

^a University of Akron   (United States)

Author keywords

Adhesive thickness; Conductive adhesive; Conductivity; Contact resistance; Copper particles; Electrically conductive epoxy; Filler particle; Nickel filaments; Nickel flakes; Nickel powder; Percolation; Resistivity; Silver particles; Volume fraction

Indexed keywords

ADHESIVES; CHLORINE COMPOUNDS; CONDUCTIVE FILMS; COPPER; ELECTRONICS PACKAGING; FILLERS; FILM THICKNESS; SILVER; SOLVENTS; SURFACE TREATMENT; VISCOSITY;

ADHESIVE THICKNESS; CONDUCTIVE ADHESIVE; CONDUCTIVE EPOXY; CONDUCTIVITY; COPPER PARTICLES; ELECTRICALLY CONDUCTIVE; ELECTRICALLY CONDUCTIVE EPOXY; FILLER PARTICLES; NICKEL FILAMENT; NICKEL FLAKES; NICKEL POWDERS; RESISTIVITY; SILVER PARTICLES;

VOLUME FRACTION;

EID: 84857642890     PISSN: None     EISSN: 20734360     Source Type: Journal    
DOI: 10.3390/polym3010427     Document Type: Article

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