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Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 7, 2011, Pages 735-740

Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

(7) Ho, Li Ngee a,b Wu, Teng Fei a Nishikawa, Hiroshi a Takemoto, Tadashi a Miyake, Koichi c Fujita, Masakazu c Ota, Koyu d

a OSAKA UNIVERSITY (Japan)

b UNIVERSITY MALAYSIA PERLIS (Malaysia)

c MITSUI MINING AND SMELTING CO LTD (Japan)

d Kamioka Mining and Smelting Co Ltd (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL RELIABILITY; ELECTRICAL RESISTIVITY; ELECTRICALLY CONDUCTIVE ADHESIVES; HIGH HUMIDITY; HIGH-TEMPERATURE EXPOSURE; THERMALLY STABLE;

ADHESIVES; ALLOYING; ELECTRIC CONDUCTIVITY; FILLERS; SILVER; THERMODYNAMIC STABILITY;

SILVER ALLOYS;

EID: 80051665067 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-010-0202-z Document Type: Article

Times cited : (11)

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