Reliability of flexible electrically conductive adhesives

Polymers for Advanced Technologies

Volumn 24, Issue 1, 2013, Pages 114-117

  Cui, Hui wang ^a,b   Li, Dong sheng ^a   Fan, Qiong ^a  

^a SHANGHAI UNIVERSITY   (China)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Electrical properties; Electronic materials; Mechanical properties; Thermal properties

Indexed keywords

1 ,3 PROPANEDIOL; AGING TESTS; BULK RESISTANCE; CONNECTION INTERFACE; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRONIC DEVICE; ELECTRONIC MATERIALS; FLEXIBILIZER; HUMID ENVIRONMENT; HUMIDITY LEVELS;

ATMOSPHERIC HUMIDITY; BONDING; DELAMINATION; MECHANICAL PROPERTIES; TESTING; THERMODYNAMIC PROPERTIES;

ELECTRIC PROPERTIES;

EID: 84871678279     PISSN: 10427147     EISSN: 10991581     Source Type: Journal    
DOI: 10.1002/pat.3059     Document Type: Article

References (15)

1. Y. Fu, M. Willander, J. Liu, J. Electron. Mater. 2001, 30, 866.
2. Z. Mo, X. Wang, T. Wang, S. Li, Z. Lai, J. Liu, J. Electron. Mater. 2002, 31, 916.
3. I. Masahiro, M. Hiroaki, M. Takuji, Y. Shinsuke, S. Katsuaki, J. Electron. Mater. 2008, 37, 462.
4. I. Masahiro, J. Liu, Proceedings of 2008 2nd Electronics Systemintegration Technology Conference, Greenwich, CT, USA, 2008, 1147.
5. W. Du, C. Fu, S. Chen, H. Cui, X. Liu, T. Chen, J. Liu, Proceedings of 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Xi'an, China, 2010, 199.
6. H. Lai, X. Lu, H. Cui, X. Liu, S. Chen, T. Chen, J. Liu, Proceedings of 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Xi'an, China, 2010, 235.
7. H. Lai, X. Lu, S. Chen, C. Fu, J. Liu, Proceedings of 2010 International Symposium on Advanced Packaging Materials: Microtech, Cambridge, UK, 2010, 49.
8. Q. Fan, H. Cui, C. Fu, D. Li, X. Tang, Z. Yuan, L. Ye, J. Liu, ECS Trans. 2011, 34, 811.
9. W. Tao, S. Chen, X. Liu, H. Cui, T. Chen, J. Liu, Proceedings of 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Xi'an, China, 2010, 225.
10. D. Li, H. Cui, S. Chen, Q. Fan, Z. Yuan, L. Ye, J. Liu, ECS Trans. 2011, 34, 583.
11. W. Du, H. Cui, S. Chen, Z. Yuan, L. Ye, J. Liu, ECS Trans. 2011, 34, 805.
12. C. Fu, S. Chen, P. Berggren, Q. Fan, W. Du, B. Ganesh, J. Liu, Proceedings of 2010 International Symposium on Advanced Packaging Materials: Microtech, Cambridge, UK, 2010, 29.
13. Y. C. Lin, X. Chen, Mater. Lett. 2005, 59, 3831.
14. Y. C. Lin, X. Chen, Polym. 2005, 46, 11994.
15. Y. C. Lin, X. Chen, Chem. Phy. Lett. 2005, 412, 322.