Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives

Electronic Materials Letters

Volumn 9, Issue 1, 2013, Pages 1-5

  Cui, Hui wang ^a,b   Li, Dong sheng ^a,c   Fan, Qiong ^a,d  

^a SHANGHAI UNIVERSITY   (China)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^c Department of Precision Motion Engineering Shanghai Micro Electronics Equipment Co Ltd   (China)

^d ANHUI JIANGHUAI AUTOMOBILE CO LTD   (China)

Author keywords

electrical properties; electrically conductive adhesives; nano particles; thermal properties

Indexed keywords

ADHESIVES; BORON CARBIDE; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; III-V SEMICONDUCTORS; NANOPARTICLES; NITRIDES; SILICON CARBIDE; THERMODYNAMIC PROPERTIES;

CONDUCTIVE FILLERS; CONTINUOUS DEVELOPMENT; CUBIC SILICON CARBIDE; ELECTRICAL CONDUCTIVITY; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRONIC PACKAGING; ELECTRONIC PRODUCT; HEXAGONAL BORON NITRIDE;

THERMAL CONDUCTIVITY;

EID: 84872793648     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-012-2114-y     Document Type: Article

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