Electrically Conductive Adhesive Formulations for SMT Applications

Journal of Electronic Packaging

Volumn 124, Issue 4, 2002, Pages 367-370

  Kisiel, Ryszard ^a  

^a WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347014068     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1497628     Document Type: Article

References (8)

1. th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland 18-21 June, p. 121.
2. Rosenberd, Halle, 1992, "Electrically Conductive Adhesives for SMT," Elektronik Centralen, Denmark, Aug.
3. th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, p. 240.
4. Kisiel, R., and Mościcki, A., 2000, "Electrically conductive adhesives in SMT-the influence of adhesive composition on mechanical and electrical properties," Proc. of XXIV IMAPS Conference, Rytro, Poland, September 25-28, p. 199.
5. Ross, P. J., 1988, "Taguchi Techniques fur Qualin Engineering," McGraw-Hill, New York.
6. st International Spring Seminar on Electronics Technology, Neusiedl am SEE, Austria, May 4-7, p. 32.
7. th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoom, Finland, June 18-21, p. 110.
8. th International Spring Seminar on Electronics Technology, Szklarska Poreba, Poland, June 8-11, p. 13.