Formulation and characterization of electrically conductive adhesives for electronic packaging

Journal of Adhesion

Volumn 89, Issue 1, 2013, Pages 19-36

  Cui, Hui Wang ^a,b   Fan, Qiong ^a   Li, Dong Sheng ^a   Tang, Xin ^a  

^a SHANGHAI UNIVERSITY   (China)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

ECAs; Electrical properties; Thermal properties

Indexed keywords

BULK RESISTIVITY; CURING AGENTS; CURING TIME; DIFFERENT EFFECTS; ECAS; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRONIC PACKAGING; HIGH TEMPERATURE; HIGH TEMPERATURE STABILITY; HIGH THERMAL CONDUCTIVITY; IN-PLANE DIRECTION; MATRIX RESIN; NANO SILVER; PYROLYSIS TEMPERATURE; REACTIVE DILUENTS; SILANE COUPLING AGENT; SILVER SPHERES; VERTICAL DIRECTION;

COUPLING AGENTS; CURING; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; FILLERS; RESINS; SILVER; SPHERES; THERMODYNAMIC PROPERTIES;

THERMAL CONDUCTIVITY;

EID: 84870271152     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218464.2012.725621     Document Type: Article

References (29)

1. Liu, J., Mater. Technol. 10, 247-252 (1995).
2. Kristiansen, H. and Liu, J., IEEE Tran. Compon. Pack. Manuf. 21, 208-214 (1998).
3. Li, Y., Moon, K. S., and Wong, C. P., Science 308, 1419-1420 (2005).
4. Lu, D. Q. and Wong, C. P., IEEE Tran. Compon. Pack. Manuf. 23, 620-626 (2000).
5. Rörgren, R. S. and Liu, J., IEEE Tran. Compon. Pack. Manuf. 18, 305-311 (1995).
6. Tao, W.-K., Chen, S., Liu, X.-H., Cui, H.-W., Chen, T.-A., and Liu, J., Proceedings of 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Xi'an, China, (2010), p. 225-228.
7. Li, D.-S., Cui, H.-W., Chen, S., Fan, Q., Yuan, Z.-C., Ye, L.-L., and Liu, J., ECS Tran. 34, 583-588 (2011).
8. Li, D.-S., Cui, H.-W., Fan, Q., Duan, Y.-J., Yuan, Z.-C., Ye, L.-L., and Liu, J., Proceedings of 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, (2011), p. 430-435.
9. Du, W.-H., Cui, H.-W., Chen, S., Yuan, Z.-C., Ye, L.-L., and Liu, J., ECS Tran. 34, 805-810 (2011).
10. Khoo, C. and Liu, J., Circuit World 22, 9-15 (1996).
11. Fu, Y., Liu, J., and Willander, M., Int. J. Adhes. Adhes. 19, 281-286 (1999).
12. Fu, Y., Wang, T., and Liu, J., IEEE Tran. Compon. Pack. Manuf. 26, 193-198 (2003).
13. Ye, L. L., Lai, Z. H., Liu, J., and Thölén, A., IEEE Tran. Compon. Pack. Manuf. 22, 299-302 (1999).
14. Fu, Y., Willander, M., and Liu, J., J. Electron. Mater. 30, 866-871 (2001).
15. Du, W.-H., Fu, C.-E., Chen, S., Cui, H.-W., Liu, X.-H., Chen, T.-A., and Liu, J., Proceedings of 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Xi'an, China, (2010), p. 199-201.
16. Du, W.-H., Cui, H.-W., Chen, S., Yuan, Z.-C., Ye, L.-L., and Liu, J., Proceedings of 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, (2011), p. 1053-1055.
17. Lai, H.-X., Lu, X.-Z., Cui, H.-W., Liu, X.-H., Chen, S., Chen, T.-A., and Liu, J., Proceedings of 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Xi'an, China, (2010), p. 235-239.
18. Fan, Q., Cui, H.-W., Fu, C.-E., Li, D.-S., Tang, X., Yuan, Z.-C., Ye, L.-L., and Liu, J., ECS Tran. 34, 811-816 (2011).
19. Fan, Q., Cui, H.-W., Li, D.-S., Hu, Z.-L., Yuan, Z.-C., Ye, L.-L., and Liu, J., Proceedings of 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China (2011), p. 423-425.
20. Mo, Z.-M., Wang, X.-T., Wang, T.-B., Li, S.-M., Lai, Z.-H., and Liu, J., J. Electron. Mater. 31, 916-920 (2002).
21. Inoue, M., Muta, H., Maekawa, T., Yamanaka, S., and Suganuma, K., J. Electron. Mater. 37, 462-468 (2008).
22. Inoue, M. and Liu, J., Proceedings of 2008 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, (2008), p. 1147-1152.
23. Du, F. M., Scogna, R. C., Zhou, W., Brand, S., Fischer, J. E., and Winey, K. I., Macromolecules 37, 9048-9055 (2004).
24. Mach, Pavel., Radev, R., and Pietrikova, A., Proceedings of 2008 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, (2008), p. 1141-1146.
25. Agari, Y., Shimada, M., and Ueda, A., Netsu Bussei. 9, 17-23 (1995).
26. Campbell, R. C., Smith, S. E., and Dietz, R. L., Proceedings of 1999 15th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Diego, CA, USA, (1999), p. 83-97.
27. Jiang, H. J., Moon, K. S., Li, Y., and Wong, C. P., Chem. Mater. 18, 2969-2973 (2006).
28. Zhang, R., Moon, K.-S., Jiang, H., Lin, W., and Wong, C. P., Proceedings of PORTABLE-POLYTRONIC 2008 2nd IEEE International Interdisciplinary Conference on Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Germany, (2008), p. 1-5, Garmish-Partenkirchen.
29. Mach, P., Busek, D., and Polansky, R., Proceedings of 2010 3rd Electronic System-Integration Technology Conference (ESTC), p. 1-5, Berlin, Germany (2010).