Preparation and characterization of a novel epoxy molding compound with low storage modulus at high temperature and low glass-transition temperature

Journal of Electronic Materials

Volumn 41, Issue 9, 2012, Pages 2599-2605

  Cui, Hui Wang ^a,b   Li, Dong Sheng ^a   Fan, Qiong ^a  

^a SHANGHAI UNIVERSITY   (China)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

EMC; mechanical properties; PBA; water absorption

Indexed keywords

1 ,3 PROPANEDIOL; ELEVATED TEMPERATURE; EPOXY MOLDING COMPOUNDS; HIGH HEAT RESISTANCE; HIGH MOISTURE; HIGH TEMPERATURE; LEAD FRAME; LEAD FREE SOLDERS; LOW COSTS; MECHANICAL PERFORMANCE; PBA; PULL FORCE; SEMICONDUCTOR PACKAGES; SOLDERING PROCESS; SOLDERING TEMPERATURE;

ELASTIC MODULI; ELECTROMAGNETIC COMPATIBILITY; GLASS; HEAT RESISTANCE; LEAD; MECHANICAL PROPERTIES; SOLDERING; THERMAL STRESS; TIN; WATER ABSORPTION;

TEMPERATURE;

EID: 84865221988     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-2105-7     Document Type: Article

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