Adhesion of a novel flexible epoxy molding compound and its molecular dynamics simulation

International Journal of Adhesion and Adhesives

Volumn 35, Issue , 2012, Pages 50-54

  Cui, Hui Wang ^a   Li, Dong Sheng ^a   Fan, Qiong ^a  

^a SHANGHAI UNIVERSITY   (China)

Author keywords

Dynamic mechanical analysis; Epoxides; Finite element stress analysis; Interfaces; Mechanical properties of adhesives

Indexed keywords

1 ,3 PROPANEDIOL; EPOXIDES; EPOXY MOLDING COMPOUNDS; FINITE ELEMENT STRESS ANALYSIS; FLEXIBILIZER; HIGH TEMPERATURE; INTERFACIAL BONDING; LEAD FRAME; MECHANICAL PROPERTIES OF ADHESIVES; MOLECULAR DYNAMICS SIMULATIONS; PULL FORCE; SOLDERING PROCESS;

COPPER; DYNAMIC MECHANICAL ANALYSIS; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; MOLECULAR DYNAMICS; MOLECULAR MECHANICS; SILVER; SILVER OXIDES; STRESS ANALYSIS;

ADHESION;

EID: 84862825094     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2012.02.001     Document Type: Article

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