High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package

International Journal of Adhesion and Adhesives

Volumn 44, Issue , 2013, Pages 220-225

  Cui, Hui Wang ^a,b,c   Kowalczyk, Agnieszka ^d   Li, Dong Sheng ^a   Fan, Qiong ^a  

^a SHANGHAI UNIVERSITY   (China)

^b OSAKA UNIVERSITY   (Japan)

^c NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^d WEST POMERANIAN UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Electrical properties; Mechanical properties; Polymer matrix composites (PMCs)

Indexed keywords

BULK RESISTIVITY; ELECTRICALLY CONDUCTIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRONIC PACKAGE; ELECTRONIC PACKAGING; HUMIDITY LEVELS; POLYMER MATRIX COMPOSITES (PMCS); SILVER SPHERES;

ATMOSPHERIC HUMIDITY; CARBON NANOTUBES; CONTACT RESISTANCE; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; POLYMER MATRIX COMPOSITES; RESINS; SPHERES;

SILVER;

EID: 84876118059     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2013.03.004     Document Type: Article

References (27)

1. Yi Li, and C.P. Wong Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications Mater Sci Eng R 51 2006 1 35 (Pubitemid 43344279)
2. Irfan Mir, and D. Kumar Recent advances in isotropic conductive adhesives for electronics packaging applications Int J Adhes Adhes 28 2008 362 371
3. Hsien-Hsuen Lee, Kan-Sen Chou, and Zong-Whie Shih Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives Int J Adhes Adhes 25 2005 437 441 (Pubitemid 40682556)
4. H.P. Wu, J.F. Liu, X.J. Wu, M.Y Ge., Y.W. Wang, G.Q. Zhang, and J.Z. Jiang High conductivity of isotropic conductive adhesives filled with silver nanowires Int J Adhes Adhes 26 2006 617 621
5. Wen-kai Tao, Si Chen, Xiao-hua Liu, Hui-wang Cui, Tian-an Chen, Johan Liu, Reliability characterization of bi-modal high temperature stable isotropic conductive adhesives, In: Proceedings of 2010 11th international conference on electronic packaging technology and high density packaging, Xi'an, China, 2010, p. 225-228.
6. Dong-sheng Li, Hui-wang Cui, Si Chen, Qiong Fan, Zhi-chao Yuan, Li-lei Ye, and Johan Liu A highly conductive bimodal isotropic conductive adhesive and its reliability ECS Trans 34 2011 583 588
7. Dong-sheng Li, Hui-wang Cui, Qiong Fan, Ya-jun Duan, Zhi-chao Yuan, Li-lei Ye, Johan Liu, Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives, In: Proceedings of 2011 12th international conference on electronic packaging technology and high density packaging, Shanghai, China, 2011, p. 430-435.
8. Wen-hui Du, Hui-wang Cui, Si Chen, Zhi-chao Yuan, Li-lei Ye, and Johan Liu Study on the reliability of fast curing isotropic conductive adhesive ECS Trans 34 2011 805 810
9. Y. Fu, J. Liu, and M. Willander Conduction modeling of a conductive adhesive with bimodal distribution of conducting elements Int J Adhes Adhes 19 1999 281 286
10. Y. Fu, T. Wang, and J. Liu Microwave-transmission, heat and temperature properties of electrically conductive adhesive IEEE Trans Compon Pack Manuf 26 2003 193 198
11. Y. Fu, M. Willander, and J. Liu Spatial distribution of metal fillers in isotropically conductive adhesives J Electron Mater 30 2001 866 871 (Pubitemid 32742692)
12. Wen-hui Du, Chun-e Fu, Si Chen, Hui-wang Cui, Xiao-hua Liu, Tian-an Chen, Johan Liu, New fast curing isotropic conductive adhesive for electronic packaging application, In: Proceedings of 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Xi'an, China, 2010, p. 199-201.
13. Wen-hui Du, Hui-wang Cui, Si Chen, Zhi-chao Yuan, Li-lei Ye, Johan Liu, Study into high temperature reliability of isotropic conductive adhesive, In: Proceedings of 2011 12th international conference on electronic packaging technology and high density packaging, Shanghai, China, 2011, p. 1053-1055.
14. Hua-xiang Lai, Xiu-zhen Lu, Hui-wang Cui, Xiao-hua Liu, Si Chen, Tian-an Chen, Johan Liu, Effects of BN and SiC nanoparticles on properties of conductive adhesive, In: Proceedings of 2010 11th international conference on electronic packaging technology and high density packaging, Xi'an, China, 2010, p. 235-239.
15. Qiong Fan, Hui-wang Cui, Chun-e Fu, Dong-sheng Li, Xin Tang, Zhi-chao Yuan, Li-lei Ye, and Johan Liu The effect of functionalized silver on rheological and electrical properties of conductive adhesives ECS Trans 34 2011 811 816
16. Qiong Fan, Hui-wang Cui, Dong-sheng Li, Zhi-li Hu, Zhi-chao Yuan, Li-lei Ye, Johan Liu, The effect of functionalized silver on properties of conductive adhesives, In: Proceedings of 2011 12th international conference on electronic packaging technology and high density packaging, Shanghai, China, 2011, p. 423-425.
17. Zhi-min Mo, Xi-tao Wang, Tie-bing Wang, Shi-ming Li, Zong-he Lai, and Johan Liu Electrical characterization of isotropic conductive adhesive under mechanical loading J Electron Mater 31 2002 916 920
18. Masahiro Inoue, Hiroaki Muta, Takuji Maekawa, Shinsuke Yamanaka, and Katsuaki Suganuma Temperature dependence of electrical and thermal conductivities of an epoxy-based isotropic conductive adhesive J Electron Mater 37 2008 462 468
19. Masahiro Inoue, Johan Liu, Electrical and thermal properties of electrically conductive adhesives using a heat-resistant epoxy binder, In: Proceedings of 2008 2nd electronics systemintegration technology conference, Greenwich, CT, USA, 2008, p. 1147-1152.
20. Rongwei Zhang, Kyoung-Sik Moon, Hongjing Jiang, Wei Lin, C.P. Wong, Development of transparent and flexible electrically conductive adhesives for microelectronics applications, In: Proceedings of the PORTABLE-POLYTRONIC 2008 2nd IEEE international interdisciplinary conference on portable information devices, 2008 and the 2008 7th IEEE conference on polymers and adhesives in microelectronics and photonics, Garmish-Partenkirchen, Germany, 2008, p. 1-5.
21. Yi Li, Kyoung-sik Moon, C.P. Wong, Electrically conductive adhesives and methods of making. US Patent: 7527749, 2009.
22. P. Mach, D. Busek, R. Polansky, Thermomechanical analysis of electrically conductive adhesives, In: Proceedings of 2010 3rd electronic system-integration technology conference (ESTC), Berlin, Germany, 2010, p. 1-5.
23. J. Liu, Z. Lai, H. Kristiansen, C. Khoo, Overview of conductive adhesive joining technology in electronics packaging applications, In: Proceedings of 3rd international conference on adhesive joining and coating technology in electronics manufacturing, Binghamton, NY, USA, 1998, p. 1-18.
24. C. Tan, Y.C. Chan, and N.H. Yeung Effect of autocalve test on anisotropic aonductive joints, Microelectron Reliab 43 2003 279 285
25. Y.C. Lin, and X. Chen Investigation of the effect of hygrothermal conditions on epoxy system by fractography and computer simulation Mater Lett 59 2005 3831 3836 (Pubitemid 41455422)
26. Y.C. Lin, and X. Chen Moisture sorption-desorption-resorption characteristics and its effect on the mechanical behavior of the epoxy system Polymer 46 2005 11994 12003 (Pubitemid 41653398)
27. Y.C. Lin, and X. Chen Investigation of moisture diffusion in epoxy system: Experiments and molecular dynamics simulations Chem Phys Lett 412 2005 322 326 (Pubitemid 41203387)