Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives

Rare Metals

Volumn 31, Issue 1, 2012, Pages 64-70

  Zhu, Xiaoyun ^a   Liu, Yuanlong ^a   Long, Jinming ^a   Liu, Xiaoli ^a  

^a KUNMING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Ag plated Cu composite powder; Composite material; Electrically conductive adhesives; Electrochemical migration

Indexed keywords

CATHODE AND ANODE; COMPOSITE POWDERS; CONSTANT VOLTAGE; CURRENT-TIME CURVES; DISTILLED WATER; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTROCHEMICAL MIGRATION; INHIBITING MECHANISM; SEM/EDS; TAFEL PLOTS; XRD;

COMPOSITE MATERIALS; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY;

SILVER;

EID: 84863070549     PISSN: 10010521     EISSN: 18677185     Source Type: Journal    
DOI: 10.1007/s12598-012-0464-0     Document Type: Article

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