Surfactant-free synthesis of copper particles for electrically conductive adhesive applications

Journal of Electronic Materials

Volumn 41, Issue 9, 2012, Pages 2527-2532

  Ho, Li Ngee ^a,b   Nishikawa, Hiroshi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b UNIVERSITY MALAYSIA PERLIS   (Malaysia)

Author keywords

conductive adhesive; copper; electrical resistivity; Synthesis

Indexed keywords

AGING TIME; CONDUCTIVE ADHESIVE; COPPER PARTICLES; ELECTRICAL RESISTIVITY; ELECTRICALLY CONDUCTIVE ADHESIVES; HIGH-TEMPERATURE EXPOSURE; MICROWAVE-ASSISTED; SURFACTANT-FREE; THERMALLY STABLE;

COPPER; CURING; ELECTRIC CONDUCTIVITY; SYNTHESIS (CHEMICAL); THERMODYNAMIC STABILITY;

SILVER;

EID: 84865249584     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-2102-x     Document Type: Article

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