SCOPUS 정보 검색 플랫폼

Microelectronics Journal

Volumn 32, Issue 4, 2001, Pages 315-321

Electrical reliability of electrically conductive adhesive joints: Dependence on curing condition and current density

(2) Kim, H K a Shi, F G a

a UNIVERSITY OF CALIFORNIA (United States)

Author keywords

Ag Ag Cu filler; Conductive adhesive; Contact resistance; Cure degree; Current density

Indexed keywords

ADHESIVE JOINTS; CONDUCTIVE MATERIALS; CURRENT DENSITY; ELECTRIC RESISTANCE; FLIP CHIP DEVICES; INTERCONNECTION NETWORKS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS;

ELECTRICALLY CONDUCTIVE ADHESIVE JOINTS;

ELECTRONICS PACKAGING;

EID: 0035311330 PISSN: 00262692 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-2692(01)00007-6 Document Type: Article

Times cited : (81)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.