Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints

Soldering & Surface Mount Technology

Volumn 21, Issue 4, 2009, Pages 12-18

  Wickham, Martin ^a   Zou, Ling ^a   Hunt, Christopher ^a  

^a NATIONAL PHYSICAL LABORATORY   (United Kingdom)

Author keywords

Adhesives; Lead; Parts; Reliability management; Solders; Surface conductivity

Indexed keywords

EID: 84992974175     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910910989385     Document Type: Article

References (14)

1. Daoqiang, L., Tong, Q.K. and Wong, C.P. (1999), “Mechanisms underlying the unstable contact resistance of conductive adhesives”, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22 No. 3, pp. 228-232.
2. (The) European Parliament (2003), “Directive 2002/95/EC of The European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment”, available at: www.rohs.gov.uk/Docs/Links/RoHS%20directive.pdf.
3. Gaynes, M.A., Lewis, R.H., Saraf, R.F. and Roldan, J.M. (1995), “Evaluation of contact resistance for isotropic electrically conductive adhesives”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, Vol. 18 No. 2, pp. 299-304.
4. Jagt, J.C., Beris, P.J.M. and Lijiten, G.F.C.M. (1995), “Electrically conductive adhesives: a prospective alternative for SMD soldering?”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, Vol. 18 No. 2, pp. 293-7.
5. Lee, J., Cho, C.S. and Morris, J.E. (2009), “Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards”, Microsystem Technologies, Vol. 15, pp. 145-9.
6. Li, L., Lizzul, C., Kim, H., Sacolick, I. and Morris, J.E. (1993), “Electrical, structural and processing properties of electrically conductive adhesives”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 16 No. 8, pp. 843-851.
7. Li, Y. and Wong, C.P. (2006), “Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications”, Materials Science and Engineering Reports, Vol. 51, pp. 1-35.
8. Mir, I. and Kumar, D. (2008), “Recent advances in isotropic conductive adhesives for electronics packaging applications”, International Journal of Adhesion & Adhesives, Vol. 28, pp. 362-371.
9. Moon, K.S., Liong, S., Haiying, L. and Wong, C.P. (2004), “Stabilizing contact resistance of isotropically conductive adhesives on various metal surface by incorporating sacrificial anode materials”, Journal of Electronic Materials, Vol. 33, Part 11, pp. 1381-8.
10. Morris, J.E. (2007), “Isotropic conductive adhesives: future trends, possibilities and risks”, Microelectronics Reliability, Vol. 47, pp. 328-330.
11. Pernice, R.F., Hannafin, J.J. and Estes, R.H. (1994), “Evaluation of isotropic conductive adhesives for solder replacement”, Proceedings of the 27th International Symposium on Microelectronics, Reston, VA.
12. Wickham, M., Zou, L. and Hunt, C. (2004), “Developing a stress screening regime for isotropic electrically conductive adhesives”, NPL Report DECP-MPR 005, July.
13. Xu, S., Dillard, D.A. and Dillard, J.G. (2003), “Environmental aging effects on the durability of electrically conductive adhesive joints”, International Journal of Adhesion and Adhesives, Vol. 23, pp. 245-250.
14. Zwolinski, M., Hickman, J., Rubon, H. and Zaks, Y. (1996), “Electrically conductive adhesives for surface mount solder replacement”, Adhesives in Electronics '96, Second International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Stockholm, June, pp. 333-340.