The effect of reduction capability of resin material on the solder wettability for electrically conductive adhesives (ECAs) assembly

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 793-798

  Kim, Jong Min ^a   Yasuda, Kiyokazu ^a   Yasuda, Masahiro ^a   Fujimoto, Kozo ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Assembly process; Electrically conductive adhesive; Lead free solder; Microelectronic and optoelectronic applications; Reduction capability; Wettability

Indexed keywords

ADHESIVES; BINDERS; CAMERAS; CHARGE COUPLED DEVICES; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; ENVIRONMENTAL IMPACT; FILLERS; HEALTH HAZARDS; OPTICAL MICROSCOPY; ORGANIC ACIDS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; TOXICITY; WETTING;

ASSEMBLY PROCESS; ELECTRICALLY CONDUCTIVE ADHESIVE; LEAD-FREE SOLDER; MICROELECTRONIC AND OPTOELECTRONIC APPLICATIONS; REDUCTION CAPABILITY; WETTABILITY;

SOLDERING ALLOYS;

EID: 2442566737     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.793     Document Type: Article

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