Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging

Microelectronics Reliability

Volumn 52, Issue 6, 2012, Pages 1165-1173

  Yim, Byung Seung ^a   Kwon, Yumi ^a   Oh, Seung Hoon ^a   Kim, Jooheon ^a   Shin, Yong Eui ^a   Lee, Seong Hyuk ^a   Kim, Jong Min ^a  

^a Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING CHARACTERISTICS; CLEAVAGE FRACTURE; CU-SN INTERMETALLICS; CURING BEHAVIOR; CURING PROCESS; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRONIC PACKAGING; FRACTURE SURFACES; IMC LAYER; LOW MELTING POINT ALLOY; QUAD FLAT PACKAGE; WETTING TESTS;

BRITTLE FRACTURE; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; SOLDERING ALLOYS; TIN; VISCOMETERS; WETTING;

COALESCENCE;

EID: 84861573207     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.12.004     Document Type: Article

References (22)

1. H.K. Kim, and F.G. Shi Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density Microelectron J 32 2001 315 321
2. M.J. Yim, and K.W. Paik Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications Int J Adhes Adhes 26 2006 304 313
3. D. Wojciechowski, J. Vanfleteren, E. Reese, and H.-W. Hagedorn Electro-conductive adhesives for high density package and flip-chip interconnection Microelectron Reliab 40 2000 1215 1226
4. M.J. Yim, J.S. Hwang, J.G. Kim, J.Y. Ahn, H.J. Kim, and W.S. Kwon Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film J Electron Mater 33-1 2004 76 82
5. H.J. Jiang, K.S. Moon, J. Lu, and C.P. Wong Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization J Electron Mater 34-11 2005 1432 1439
6. J.M. Kim, K. Yasuda, M. Rito, and K. Fujimoto New electrically conductive adhesives filled with low melting point alloy fillers Mater Trans 45-1 2004 157 160
7. M.J. Yim, Y. Li, K.S. Moon, K.W. Paik, and C.P. Wong Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging J Adhes Sci Technol 22 2008 1593 1630
8. Tong QK, Markley DL, Frederickson G, Kuder R, Lu D. Conductive adhesives with stable contact resistance and superior impact performance. In: Proc 49th electronic components and technology conference, vol. 49; 1999. p. 347-52.
9. Y.S. Eom, J.W. Baek, J.T. Moon, J.D. Nam, and J.M. Kim Characterization of polymer matrix and low melting point solder for anisotropic conductive film Microelectron Eng 85 2008 327 331
10. M. Zwolinski, J. Hickman, H. Rubin, Y. Zaks, S. McCarthy, and T. Hanlon Electrically conductive adhesives for surface mount solder replacement IEEE Trans Compon Packag Manuf Technol Part C 19 1996 241 250
11. S.K. Kang, and S. Purushothaman Development of conducting adhesive materials for microelectronic applications J Electron Mater 28-11 1999 1314 1318
12. K.S. Moon, J. Wu, and C.P. Wong Improved stability of contact resistance of low melting point alloy incorporated isotropically conductive adhesives IEEE Trans Compon Packag Technol 26-2 2003 375 381
13. D. Lu, and C.P. Wong Isotropic conductive adhesives filled with low-melting-point alloy fillers IEEE Trans Electron Packag Manuf 23-3 2000 185 190
14. J.M. Kim, K. Yasuda, and K. Fujimoto Isotropic conductive adhesives with fusible filler particles J Electron Mater 33-11 2004 1331 1337
15. B.S. Yim, J.M. Kim, S.H. Jeon, S.H. Lee, J.H. Kim, and J.G. Han Self-organized interconnection process using solderable ACA (Anisotropic Conductive Adhesive) Mater Trans 50-7 2009 1684 1689
16. Y.S. Eom, K.S. Jang, J.T. Moon, J.D. Nam, and J.M. Kim Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder Microelectron Eng 85-11 2008 2202 2206
17. B.S. Yim, J.M. Kim, S.H. Jeon, S.H. Lee, J.H. Kim, and J.G. Han Hybrid interconnection process using solderable ICAs (Isotropic Conductive Adhesives) with low-melting-point alloy fillers Mater Trans 50-11 2009 2649 2655
18. J.M. Kim, K. Yasuda, M. Yasuda, and K. Fujimoto The effect of reduction capability of resin material on the solder wettability for electrically conductive adhesives (ECAs) assembly Mater Trans 45-3 2004 793 798
19. K. Yasuda, J.M. Kim, M. Yasuda, and K. Fujimoto New process of self-organized interconnection in packaging using conductive adhesive with low melting point filler Jpn J Appl Phys 43-4B 2004 2277 2282
20. P.J. Shang, Z.Q. Liu, D.X. Li, and J.K. Shang TEM observation of the growth of intermetallic compounds at the SnBi/Cu interface J Electron Mater 38-12 2009 2579 2584
21. P. Sun, C. Andersson, X. Wei, Z. Cheng, D. Shangguan, and J. Liu Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate J Alloys Compd 437 2007 169 179
22. J.W. Yoon, and S.B. Jung Interfacial reaction of Cu/Sn-Ag/ENIG sandwich solder joint during aging Adv Mater Res 15-17 2007 1001 1007