A novel electrically conductive adhesive for use in microelectronics and microsystems by ink jet technology

Journal of Adhesion

Volumn 85, Issue 7, 2009, Pages 381-394

  Kolbe, Jana ^a  

^a FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM   (Germany)

Author keywords

Electrically conductive adhesive; Ink jet application; Sedimentation; UV curing

Indexed keywords

CONDUCTIVE ADHESIVE; CURING MECHANISM; DROPLET SIZES; ELECTRICAL CONDUCTIVITY; ELECTRICALLY CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRICALLY CONDUCTIVE INKS; FILLED ADHESIVES; FILLER MATERIALS; INK JET; INK JET APPLICATION; INK JET TECHNOLOGY; ISOTROPICALLY CONDUCTIVE ADHESIVES; METAL PARTICLE; METAL RATIO; MICROELECTRONICS AND MICROSYSTEMS; NEW DIMENSIONS; UV-CURING;

ADHESIVES; CONDUCTIVE MATERIALS; CURING; ELECTRIC CONDUCTIVITY; GOLD DEPOSITS; IDENTIFICATION (CONTROL SYSTEMS); INK; JETS; MICROELECTRONICS; RESINS; SILVER; SINTERING;

CONDUCTING POLYMERS;

EID: 68349085823     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218460902727472     Document Type: Conference Paper

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