Electrically conductive adhesives for electronic packaging and assembly applications

Journal of Adhesion Science and Technology

Volumn 22, Issue 8, 2008, Pages 853-869

  Matienzo, L J ^a   Das, R N ^a   Egitto, F D ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

Electrically conductive adhesives (ECAs); Electronic packaging; Materials characterization; Sintering

Indexed keywords

ADHESIVES; CONDUCTING POLYMERS; CONDUCTIVE MATERIALS; COPPER; ELECTRONICS PACKAGING; GRAIN SIZE AND SHAPE; IDENTIFICATION (CONTROL SYSTEMS); MATERIALS PROPERTIES; MECHANICAL PROPERTIES; MELTING POINT; MOLECULAR ORBITALS; MOLECULAR SPECTROSCOPY; OPTICAL MICROSCOPY; ORGANIC CONDUCTORS; PAINTING; PARTICLE SIZE; PHOTOELECTRON SPECTROSCOPY; POLYMERS; PRECIOUS METALS; SILVER; SILVER ALLOYS; SINTERING; STRUCTURAL PROPERTIES; TENSILE STRENGTH; THERMOCHEMISTRY;

(O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER; (PL) PROPERTIES; AVERAGE PARTICLE SIZE; CHEMICAL NATURE; ELECTRICAL CHARACTERISTICS; ELECTRICALLY CONDUCTIVE ADHESIVES (ECA); ELECTRONIC PACKAGING; LOW MELTING POINT; MICRO STRUCTURING; OPTICAL (PET) (OPET); RELIABILITY PERFORMANCE; SINTERING BEHAVIORS; STRENGTH (IGC: D5/D6); VOLUME RESISTIVITY (VR); X RAY PHOTOELECTRON SPECTROSCOPY (XPS);

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 46249109820     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856108X305444     Document Type: Article

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