Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging

Polymer International

Volumn 62, Issue 11, 2013, Pages 1644-1651

  Cui, Hui Wang ^a,b   Fan, Qiong ^a   Li, Dong Sheng ^a  

^a SHANGHAI UNIVERSITY   (China)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Electrical properties; Mechanical properties; Polymer matrix composites (PMCs); Thermal properties

Indexed keywords

ELECTRICAL CONDUCTIVITY; ELECTRICALLY CONDUCTIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; HIGH TEMPERATURE STABILITY; MECHANICAL AND THERMAL PROPERTIES; POLYMER MATRIX COMPOSITES (PMCS); PYROLYSIS TEMPERATURE; THERMAL EXPANSION COEFFICIENTS;

CURING; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; POLYMER MATRIX COMPOSITES; RESINS; SILVER; THERMODYNAMIC PROPERTIES;

ELECTRIC PROPERTIES;

EID: 84885428267     PISSN: 09598103     EISSN: 10970126     Source Type: Journal    
DOI: 10.1002/pi.4461     Document Type: Article

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